LED display technology offers different solutions for various needs, including SMD, COB, and ChipFlip. Each technology has its unique design and benefits, affecting display quality, durability, and efficiency.
In this blog, we’ll quickly break down these three popular LED technologies to help you understand their differences and decide which is best for your application.
SMD- Surface Mounted Device- Technology
The SMD process encapsulates three (3) chips, a red, a blue, and a green, into a bulb/lamp which lamps are then affixed to the PCB board. SMD chips take up more space on the PCB board and therefore the smallest pixel attainable is P0.9.
SMD is used primarily for indoor LED video applications.
The circuit design for SMD displays for both the Positive pole, the Anode, and the Negative pole, the Cathode, face upwards.
SMD has bracket and supports that require multiple soldering points and therefore potentially more failure points relative to the Chip-On Board technology.
The colors that can be achieved by SMD, at present, are deeper and brighter than the colors achieved with COB and Chip-Flip technologies.
Vanguard LED Displays- SMD vs ChipFlip
Chipflip- Technology
”CHIPFLIP” is a revolutionary new technology of encapsulating very fine chips to PCB boards.
The circuit design for “CHIPFLIP” for both the Positive and Negative electrodes face downward.
There is no soldering in the ” CHIPFLIP” Process”! The chip and substrate are electrically and mechanically interconnected by extremely strong solder paste bonding.
The “Chipflip Process” also employs Common Cathode technology whereby the electric current only passes through the Cathode, the negative pole or the ground. Power is not on constantly but only draws power as needed. As a result, heat generation is greatly reduced.
Chip-On-Board (COB) Technology
COB solders three (3) very fine LED chips, 1 red, 1 blue and 1 green, directly to the PCB Board resulting in a perfectly flat, uniform LED surface.
This perfectly flat, uniform LED surface enables a flawless encapsulation of the LED chips, when the epoxy resin finish is applied. As a result the surface of the LED display is anti-static and impact, dust and humidity resistant.
COB eliminates the need for brackets and supports, thereby reducing the number of soldering points. Fewer soldering points result in fewer possible failure points. The lamp failure rate is extremely low.
Chip-On-Board (COB) Technology allows for the development of very small, very reliable pixel pitches as low as P0.6 at present.
AVOE LED- COB
Read More: Comparing DIP, SMD, and ChipFlip LED Technologies
In conclusion, choosing the right LED technology—whether SMD, COB, or ChipFlip—depends on your specific needs for brightness, durability, and pixel density. At AVOE LED, we offer expert guidance and customized solutions to help you select the perfect display technology for your project. Contact us today to learn more about how our advanced LED displays can elevate your visual experience.